Microchip RTPF500T handleiding
Handleiding
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Package Mechanical Drawings
5193068 PD3068 Datasheet Revision 62.0 14
Figure 7 • Package Outline of PG257
Note: All dimensions are in inches unless otherwise stated.
Note: BSC = Basic spacing between centers.
The following table lists the supported devices for PG257.
2.3 Ceramic Quad Flat Pack
The following figures show package outlines for various packages under ceramic quad flat pack (CQFP).
2.3.1 CQ84
The following figure shows the package outline of CQ84.
Table 8 • Supported Devices for PG257
Supported Devices
A14100A
1.970" ± 0.015" square
0.105" ± 0.012"
0.100" BSC
0.120"
0.140"
0.018" ± 0.002
"
0.05" ± 0.005"
0.005" ± 0.005"
Top View
Bottom View
Side View
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
V
X
Y
1 2 3 4 5 6 7 8 9 10111213141516171819
1.800" ± 0.012
I
ndex Mark
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Productinformatie
| Merk | Microchip |
| Model | RTPF500T |
| Categorie | Niet gecategoriseerd |
| Taal | Nederlands |
| Grootte | 16061 MB |
