Microchip DOC200103 handleiding
Handleiding
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Hi-Rel Standard
Detail Requirements
Product Specication
© 2025 Microchip Technology Inc. and its subsidiaries
DS00005937A - 8
3.2. Mechanical
3.2.1. Package Outline
Table 6-1 links each Hi-Rel Standard Model Number of this specication to a corresponding package
style. Mechanical Outline information of each package style is found in the referenced gure.
3.2.2. Thermal Characteriscs
Because these TCXOs are multichip hybrid designs, the actual θ
jc
to any one given semiconductor
die will vary, but the combined average for all active devices results in a θ
jc
of approximately 40
°C/W. The typical die temperature rise at any one given semiconductor is 2 °C to 4 °C. With the
oscillator operating at +125 °C, the average junction temperature is approximately +129 °C and
under no circumstance will it ever exceed the maximum manufacturer’s rated junction temperature.
3.2.3. Lead Forming
When the lead forming option is specied, the applicable leak test specied in screening will be
performed after forming.
3.3. Electrical
3.3.1. Supply Voltages
CMOS devices are designed for 3.3 or 5 Vdc ±5% operation. Sinewave devices are designed for 3.3, 5,
12 or 15 Vdc ±5% operation.
3.3.2. Temperature Range
Operating range is IAW the chosen temperature stability code.
3.3.3. Frequency Tolerance
Temperature stability includes initial accuracy at +25 °C (with EFC), load ±10% and supply ±5%.
3.3.4. Frequency Set
All devices include an External Frequency Control (EFC) pin for the purpose of externally setting each
TCXO to its nominal frequency. The EFC shall be accomplished by connecting a resistor or trimmer
potentiometer from that Pin to GND. The EFC resistance adjustment range is 0Ω or GND to 20
kΩ max with nominal frequency typically occurring in the 3 kΩ to 13 kΩ range. Customers will be
furnished with the applicable EFC resistor value that can be used to set each individual device within
±0.2 ppm of nominal frequency at time of shipment.
3.3.5. Frequency Aging
Aging limits, when tested in accordance with MIL-PRF-55310 Group B inspection, shall not exceed ±1
ppm for the rst year and ±5 ppm for 15 years for oscillators that use crystals in the 10 MHz to 75
MHz range. For oscillators that use crystals greater than 75 MHz, the aging shall not exceed ±2 ppm
for the rst year and ±10 ppm for 15 years.
3.3.5.1. Frequency Aging Duraon Opon
For Screening Option F, the Aging test will be terminated after 15 days if the aging projection
is less than the specied aging limit. This is a common method of expediting 30-day Aging
without incurring risk to the hardware and used quite successfully for numerous customers. It
is based on the ‘least squares t’ determinations of MIL-PRF-55310 paragraph 4.8.35. Microchip’s
automated aging systems acquire data every four hours, compared to the minimum MIL-PRF-55310
requirement of once every 72 hours. This makes an extensive amount of data available to perform
very accurate aging projections. The delivered data would include the Aging plots projected to 30
days. If the units would not perform within that limit then they would continue to the full 30-day
term. For all other screening options, please advise by purchase order text if this is an acceptable
option to exercise as it assists in Production Test planning.
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Productinformatie
| Merk | Microchip |
| Model | DOC200103 |
| Categorie | Niet gecategoriseerd |
| Taal | Nederlands |
| Grootte | 4591 MB |
