Microchip DOC200103 handleiding

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Hi-Rel Standard
Quality Assurance Provisions and Vericaon
Product Specication
© 2025 Microchip Technology Inc. and its subsidiaries
DS00005937A - 10
4. Quality Assurance Provisions and Vericaon
4.1. Vericaon and Test
Device lots shall be tested prior to delivery in accordance with the applicable Screening Option letter
as stated by the 16
th
character of the part number. Table 6-8 tests are conducted in the order
shown and annotated on the appropriate process travelers and data sheets of the governing test
procedure. For devices that require Screening Options that include MIL-PRF-55310 Group A Testing,
the Post-Burn-In Electrical Test and the Group A Electrical Test are combined into one operation.
4.1.1. Screening Opons
The Screening Options, by letter, are summarized as:
Table 4-1. Screening Opons
Screening Option Description
K Modied MIL-PRF-38534 Class K Screening, Group A QCI and 30-day aging
F MIL-PRF-55310, Rev F, Class S Screening, Groups A & B QCI
S MIL-PRF-55310, Rev E, Class S Screening, Groups A & B QCI
C Modied MIL-PRF-55310 Class B Screening, Groups A & B QCI
B MIL-PRF-55310, Class B Screening, Groups A & B QCI
X Engineering Model (EM)
4.2. Oponal Design, Test, and Data Parameters
The following is a list of design, assembly, inspection, and test options that can be added by explicit
purchase order request.
a. Design Pedigree (choose one as the 5
th
character in the part number):
Table 4-2. Design Pedigree
Design Pedigree Description
E
Enhanced Element Evaluation (MIL-PRF-38534 Rev L for Class K components as specied in DOC208191),
100 krad die, Premium Q Swept Quartz
R
MIL-PRF-38534 Rev K element evaluation for Class K components,100 krad die, Swept Quartz
B Class B components, Swept Quartz
C Class B components, Non-Swept Quartz
D COTS components, Non-Swept Quartz
b. Input Voltage as the 15
th
character
c. Not Used
d. Radiographic Inspection
e. Group C Inspection: MIL-PRF-55310, Rev E (requires 8 destruct specimens)
f. Group C Inspection: MIL-PRF-55310, Rev F (requires 8 destruct specimens, includes Random
Vibration, MIL-STD-883, Method 1014 Leak Test and Life Test)
g. Group C Inspection: In accordance with MIL-PRF-38534, Table C-Xc, Condition PI (requires 8
destruct specimens – 5 pc. Life, 3 pc. RGA). Subgroup 1 ne leak test to be performed per MIL-
STD-202, Method 112, Condition C.
h. Internal Water-Vapor Content (RGA) samples and test performance
i. MTBF Reliability Calculations

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Productinformatie

MerkMicrochip
ModelDOC200103
CategorieNiet gecategoriseerd
TaalNederlands
Grootte4591 MB