Microchip 1520 handleiding

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Handleiding

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Hi-Rel Standard
Quality Assurance Provisions and Vericaon
Product Specication
© 2025 Microchip Technology Inc. and its subsidiaries
DS00005882A - 11
4.3 Test Condions
Unless otherwise stated herein, inspections are performed in accordance with those specied in
MIL-PRF-55310. Process travelers identify the applicable methods, conditions, and procedures to be
used. Examples of electrical test procedures that correspond to MIL-PRF-55310 requirements are
shown in Table 6-4.
4.3.1 Delta Limit Excepon
When MIL-PRF-55310, Revision F was being reviewed for release by manufacturers and users,
Microchip and other organizations recommended that burn-in delta limits not be applied to logic-
level measurements due to the inconsistency in attempting to measure small changes in logic levels
which inherently have ringing in the signal. This is especially true in higher frequency oscillators
measured in automated test systems that are aected by cable length that is not representative
of the user’s application and contact resistance in test xtures that do not provide a consistent
Vcc or Ground connection. The exact test setup conditions may vary slightly from pre-burn-in to
post-burn-in and cause small articial deltas in logic-level measurements that are not indicative of
an issue. Any signicant changes in logic levels will be reected in supply current deltas and/or logic
levels that exceed the min/max limits. As a result, we take exception to MIL-PRF-55310, Revision F,
Para. 4.4.5 and the delta limit for Output Low Level as specied in 4.4.5(c) shall not be applied to
Burn-in PDA.
4.4 Deliverable Data
The manufacturer supplies the following data, as a minimum, with each lot of devices:
a. As applicable to the Screening Option chosen, completed assembly and screening lot travelers,
screening data, including radiographic images, and rework history.
b. Electrical test variables data, identied by unique serial number.
c. Special items when required by purchase order such as Group C, DPA, and RGA data.
d. For Design Pedigrees E, F, and V, traceability, component LAT, enclosure LAT, and wafer lot
specic RLAT data for non-SMD active devices (if applicable).
e. Certicate of Conformance.
4.5 Discrepant Material
All MRB authority resides with the procuring activity.
4.6 Failure Analysis
Any failure during Qualication or Group C Inspection will be evaluated for root cause. The customer
will be notied after occurrence and upon completion of the evaluation.

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Productinformatie

MerkMicrochip
Model1520
CategorieNiet gecategoriseerd
TaalNederlands
Grootte3204 MB