Microchip 1520 handleiding
Handleiding
Je bekijkt pagina 10 van 21
Hi-Rel Standard
Quality Assurance Provisions and Vericaon
Product Specication
© 2025 Microchip Technology Inc. and its subsidiaries
DS00005882A - 10
4.2 Oponal Design, Test, and Data Parameters
The following is a list of design, assembly, inspection, and test options that can be selected or added
by purchase order request.
a. Design Pedigree (choose one as the 5
th
character in the part number):
Table 4-2. Design Pedigree
Design Pedigree Description
E
Enhanced Element Evaluation, (MIL-PRF-38534 Rev L for Class K components as specied in
DOC208191) 100 krad die, Premium Q Swept Quartz
F Hi-Rel design with 300 krad Class K die, Premium Q Swept Quartz
V Hi-Rel design with 100 krad Class K die, Non-Swept Quartz
D Hi-Rel design with Non-Swept Quartz and commercial grade components
b. Input Voltage, A for +5.0V, B for +3.3V, C for +2.5V, D for +1.8V as the 14
th
character
c. Not Used
d. Radiographic Inspection
e. Group C Inspection: In accordance with MIL-PRF-55310, Rev E (requires 8 destruct specimens)
f. Group C Inspection: MIL-PRF-55310, Rev F (requires 8 destruct specimens, includes Random
Vibration, MIL-STD-883, Method 1014 Leak Test and Life Test)
g. Group C Inspection: In accordance with MIL-PRF-38534, Table C-Xc, Condition PI (requires 8
destruct specimens – 5 pc. Life, 3 pc. RGA) Subgroup 1 ne leak test to be performed per MIL-
STD-202, Method 112, Test Condition C.
h. Internal Water-Vapor Content (RGA) samples and test performance
i. MTBF Reliability Calculations
j. Worst Case Analysis (unless otherwise specied, MIL-HDBK-1547)
k. Derating and Thermal Analysis (unless otherwise specied, MIL-HDBK-1547 with T
J
Max = +105 °C;
Derated Maximum Operating Temp = T
J
Max – ΔT
J
)
l. Process Identication Documentation (PID)
m. Customer Source Inspection (pre-crystal mount pre-cap, post-crystal mount pre-cap and nal).
Due to components being mounted underneath the crystal blank, pre-crystal mount pre-cap
inspection should be considered.
n. Destruct Physical Analysis (DPA): MIL-STD-1580 with exceptions as specied in Microchip
DOC203982.
o. Qualication: In accordance with MIL-PRF-55310, Rev F, Table IV (requires 16 destruct specimens).
Includes Group III, SG1 through SG6 only. ESD (SG7) not performed.
p. Qualication: In accordance with EEE-INST-002, Section C4, Table 3, Level 1 or 2 (requires 11
destruct specimens)
q. High Resolution Digital Pre-Cap Photographs (20 Megapixels minimum)
r. Hot solder dip of leads with Sn63/Pb37 solder prior to shipping.
s. As Designed Parts, Materials and Processes List
4.2.1 NASA EEE-INST-002 Compliance
A combination of Design Pedigree R, Option S Screening, and Qualication per EEE-INST-002, Section
C4, Table 3, meet the requirements of Level 1 and Level 2 device reliability.
Bekijk gratis de handleiding van Microchip 1520, stel vragen en lees de antwoorden op veelvoorkomende problemen, of gebruik onze assistent om sneller informatie in de handleiding te vinden of uitleg te krijgen over specifieke functies.
Productinformatie
| Merk | Microchip |
| Model | 1520 |
| Categorie | Niet gecategoriseerd |
| Taal | Nederlands |
| Grootte | 3204 MB |
