Advantech SKY-MXM-3500A handleiding
Handleiding
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SKY-MXM-3500A User Manual 12
2.7 Mechanical and Environmental Specifications
Table 2.4: Package Loading Specifications
Symbol Parameter Min Nominal Max Units Notes
Pcont
Maximum allowable pressure during
PCA, system assembly and operation.
- ≤60 ≤80 psi 1
Treflow
Maximum package temperature during
surface mount to printed circuit board
Refer to NVIDIA specifications 630-0011-
001
emax
Maximum allowable strain during PCA,
system assembly or operation
≤500 μstrains 2
Note! 1. This specification is based on the following conditions:
This specification is based on solder ball deformation and die chips
and cracks. Additional requirements may be needed to meet the
thermal performance and/or long term reliability as to specific appli-
cation,
When a compliant thermal interface is used between die and heat
sink, the bond line thickness must have less than 20% in variation.
The pressure should be measured on the top of the die surface by
an instrument equipped pressure sensors.
Nominal pressure is the total force divided by the die surface area.
Since the pressure may have variations across the whole surfaces.
The following additional requirement is applied:
The pressure has to be measured from the top of the die surface
with a grid resolution of 1x1mm2 for the pressure sensor.
Both nominal and maximum pressure requirement must be met.
2. Strain measurement shall follow IPC-9704, particularly on following
items:
The strain shall be measured on the top side of PCB close to the
four corners of the package. A rigid PCB is assumed.
For generic application, the max. allowable strain must be no more
than 500 μstrains for a board thickness from 1.0 to 3.2mm. A sepa-
rate requirement may be specified and the qualification test should
be performed if
– A sensitive PCB laminate and build up structure is used where
the pad cratering occurs at a PCB strain of 500 μstrains or
below.
– A weak surface finish of PCB is used where cracked solder joint
has been observed at a PCB strain of 500 μstrains or below.
– The strain rate is too high (5000 μstrains/second) during the
PCA operations.
For PCB thickness less than 1,0mm, the max. allowable strain shall
follow IPC 9704.
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Productinformatie
| Merk | Advantech |
| Model | SKY-MXM-3500A |
| Categorie | Niet gecategoriseerd |
| Taal | Nederlands |
| Grootte | 2059 MB |
