Supermicro X14DBT-FAP handleiding

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Handleiding

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For a detailed diagram of the X14DBT-FAP/-FLAP motherboard, see the layout under "Quick
Reference" on page 12.
Cold Plate
FlexTwin architectures do not include heatsinks, and only provide liquid cooling to disperse the
heat from the components. The cold plate is placed over several components, such as the
processor, to transfer the heat from the components to the liquid coolant and maintain optimal
temperature.
However, the cold plate coverage differs between X14DBT-FAP and X14DBT-FLAP.
X14DBT-FAP Cold Plate
In X14DBT-FAP, the cold plate only covers the processor.
X14DBT-FLAP Cold Plate
In X14DBT-FLAP, the cold plate covers the processor, DIMM slots, and the VRM tubes. The
cold plate covers every two DIMMs, and both sides will be liquid cooled on each DIMM.
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X14DBT-FAP/-FLAP: Component Installation

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Productinformatie

MerkSupermicro
ModelX14DBT-FAP
CategorieNiet gecategoriseerd
TaalNederlands
Grootte14774 MB