Microchip RTPF500TL handleiding
Handleiding
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Package Mechanical Drawings
5193068 PD3068 Datasheet Revision 62.0 7
2 Package Mechanical Drawings
2.1 Naming Conventions
This document lists all the package types used for Microsemi FPGAs and provides detailed drawings and
dimensions. The following table lists the package types, their acronyms, and the naming convention used
when referring to a package of that type with a particular pin count.
2.2 CPGA
The following figures show package outlines for various packages under ceramic pin grid array (CPGA).
2.2.1 PG84
The following figure shows the package outline of PG84.
Table 1 • Package Naming Conventions
Package Type Package Name Acronym
Package/Pin Naming
Convention (example)
Ceramic Packages Ceramic Pin Grid Array CPGA PG84
Ceramic Quad Flat Pack CQFP CQ208
Ceramic Chip Carrier Land Grid Substrate CCLG CC256
Ceramic Column Grid Array CCGA CG484
Ceramic Land Grid Array CLGA LG484
Plastic Packages
(leadframe-based, peripheral
leads)
Quad Flat No Lead QFN QN48
Plastic Quad Flat Pack PQFP PQ208
Thin Quad Flat Pack TQFP TQ144
Very Thin Quad Flat Pack VQFP VQ176
Plastic Quad Flat Pack (exposed heatsink) RQFP RQ208
Plastic Leaded Chip Carrier PLCC PL44
Plastic Packages
(substrate-based, area array
pins)
Plastic Ball Grid Array (PBGA) (1.27 mm
pitch)
PBGA BG272
Fine pitch plastic ball grid array (FBGA)
(1.00 mm pitch)
FBGA FG144
Chip Scale Package (0.50 mm pitch) CSP CS81
Chip Scale Package (0.80 mm pitch)
1
1. Currently the CS49, CS128, CS180, and CS289 packages are 0.80 mm pitch rather than 0.50 mm pitch.
CSP CS49
Micro Chip Scale Package UCS UC36
Very Fine Ball Pitch Grid Array VFPBA VF400
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Productinformatie
| Merk | Microchip |
| Model | RTPF500TL |
| Categorie | Niet gecategoriseerd |
| Taal | Nederlands |
| Grootte | 16061 MB |
