Microchip RTPF500T handleiding
Handleiding
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Package Mechanical Drawings
5193068 PD3068 Datasheet Revision 62.0 27
2.3.8 CQFP with Heat Sink Dimensions
The following table lists the dimensions for CQFP with heat sink.
Note: All dimensions are in inches except for CQ208, CQ256, and CQ352, which are in millimeters.
Note: BSC = Basic spacing between centers. This is a theoretical true position dimension and so has no
tolerance.
The dimensions above are for reference only. For more accurate dimensions, use the dimensions in the
SMD drawings for a specified device.
For heat sink information, refer to the Hermetic Package Mechanical Configuration document (Cavity,
weight, lid size and heat sink size) located at: http://www.microsemi.com/document-
portal/doc_view/131087-hermetic-package-mechanical-configuration.
2.4 CCLG
The following figures show package outlines for various packages under ceramic chip carrier land grid
substrate (CCLG).
2.4.1 CC256
The following figure shows the package outline of CC256.
K 65.90 BSC 65.90 BSC
L1 74.60 75.00 75.40 74.60 75.00 75.40
1. For device RTAX2000D-CQ352 and RTAX4000D-CQ352 only.
Note: All dimensions are in inches except for CQ208, CQ256, and CQ352, which are in millimeters.
Note: BSC = Basic spacing between centers. This is a theoretical true position dimension and so has no
tolerance.
Table 17 • Dimensions for CQFP with Heat Sink
JEDEC
Equivalent CQ208
CQ256
MO-134 VAR AB
Symbol Min. Nom. Max. Min. Nom. Max.
A 2.79 3.30 3.90 2.79 3.30 3.90
A1 2.00 2.30 2.80 2.00 2.30 2.80
b 0.18 0.20 0.22 0.18 0.20 0.22
c 0.11 0.15 0.17 0.11 0.15 0.18
D1/E1 28.96 29.21 29.46 35.64 36.00 36.66
D2/E2 25.5 BSC 31.5 BSC
e 0.50 BSC 0.50 BSC
F 7.05 7.75 8.45 7.05 7.75 8.45
H 70.00 BSC 70.00 BSC
K 65.90 BSC 65.90 BSC
L1 74.60 75.00 75.40 74.60 75.00 75.40
Table 16 • Dimensions for CQFP without Heat Sink
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Productinformatie
| Merk | Microchip |
| Model | RTPF500T |
| Categorie | Niet gecategoriseerd |
| Taal | Nederlands |
| Grootte | 16061 MB |
