Microchip RTPF500T handleiding
Handleiding
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Package Mechanical Drawings
5193068 PD3068 Datasheet Revision 62.0 24
Figure 14 • CQ256—Cavity Down without Heat Sink
Note: Dimensions are in millimeters. For more information on dimensions, see CQFP with Heat Sink
Dimensions, page 27.
Note: Seal ring and lid are connected to Ground.
Note: Lead material is Kovar with gold plate over nickel.
Note: Packages are shipped with the uniform ceramic tie bar.
Note: Package is cavity down, with the lid facing the bottom of the package. However, the leads can be formed
on either side if the application requires the lid to be facing the top
L1
F
K
e
b
Lid
Lead Material
Fe–Ni–Co Alloy
A
c
A1
Lid E2 E1
1
256
H
D1
D2
Top View
Side View
Bekijk gratis de handleiding van Microchip RTPF500T, stel vragen en lees de antwoorden op veelvoorkomende problemen, of gebruik onze assistent om sneller informatie in de handleiding te vinden of uitleg te krijgen over specifieke functies.
Productinformatie
| Merk | Microchip |
| Model | RTPF500T |
| Categorie | Niet gecategoriseerd |
| Taal | Nederlands |
| Grootte | 16061 MB |
