Microchip RTPF500T handleiding
Handleiding
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Package Mechanical Drawings
5193068 PD3068 Datasheet Revision 62.0 22
Figure 13 • CQ208 and CQ256—Cavity Up with Heat Sink
Note: All dimensions are in inches except for CQ208, CQ256, and CQ352, which are in millimeters. For more
information on dimensions, see CQFP with Heat Sink Dimensions, page 27.
Note: Outside lead frame holes (from dimension H) are circular for the CQ208, CQ256, and CQ352 devices..
Note: Seal ring and lid are connected to Ground.
Note: Lead material is Kovar with minimum of 60 microinches gold over nickel.
Note: Packages are shipped with the uniform ceramic tie bar.
A
b
H
D1
D2
E2 E1
F
L1
K
Ceramic
Tie Bar
Number 1
e
A1
Heat Sink
C
Lead Kovar
Lid
Top View
Side View
Bekijk gratis de handleiding van Microchip RTPF500T, stel vragen en lees de antwoorden op veelvoorkomende problemen, of gebruik onze assistent om sneller informatie in de handleiding te vinden of uitleg te krijgen over specifieke functies.
Productinformatie
| Merk | Microchip |
| Model | RTPF500T |
| Categorie | Niet gecategoriseerd |
| Taal | Nederlands |
| Grootte | 16061 MB |
