Microchip RTPF500T handleiding
Handleiding
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Revision History
5193068 PD3068 Datasheet Revision 62.0 4
• "CS128" – Obsolete for eX64, eX128, and eX256
• "CS180" – Obsolete for AX125 and eX256
• The lid size table for the CQ84, page 14 package was updated to add dimensions for RT1020 (SAR
27395).
•The CQ84 Side View and Bottom View, page 15 diagram was revised to add additional dimensions
to the side view, noting the maximum distances between the lead and the top of the package (SAR
27406).
• Corrected the CG484, page 31 diagram by removing the pin in the A1 position (SAR 30549).
•The CG896, page 32 package drawing was corrected to show the chamfered corner is at A1 (SAR
30227).
•The CG1152, page 34 and CCGA, page 31 package drawings were revised to add the CLGA side
view (SARs 29751, 30553).
•The FG896, page 71 diagram was corrected to show the D1 dimension extends from pin 1 to pin 30.
Previously the diagram showed that D1 extended from pin 1 to pin 29 (SAR 26792).
•The FG1152, page 72 diagram was corrected to show the D1 dimension extends from pin 1 to pin
34. Previously the diagram showed that D1 extended from pin 1 to pin 33 (SAR 26792).
• In the Fine Pitch Plastic Ball Grid Array Dimensions, page 73 table, dimension c for FG256 MO-192
VAR DAF1 was corrected to 0.4 to 0.6 mm. Previously it was 0.25 to 1.10 mm (SAR 28605).
• A second FG896 package was added to the Fine Pitch Plastic Ball Grid Array Dimensions, page 73
table. It differs from the first FG896 package only in the D2 and E2 dimensions.
• The VF289 package name was changed back to CS289, page 92 (SAR 27395).
1.24 Revision 39.0
The following is a summary of the changes in revision 39.0 of this document.
• The versioning system has been changed. This document is assigned a revision number that
increments each time the document is updated.
• SmartFusion devices A2F060, A2F200, and A2F500 were added to the supported devices table for
the FG256 MO-192 VAR DAF1, page 62 and Fine Pitch Plastic Ball Grid Array Dimensions, page 73
(SAR 25571).
• SmartFusion devices A2F200 and A2F500 were added to the supported devices table for the
FG484—Fully Populated MS-034 VAR AAJ-1, page 66 Fine Pitch Plastic Ball Grid Array
Dimensions, page 73 (SAR 25571).
• The following package names were changed:
• 36-Pin CSP was changed to UC36, page 79
• 289-Pin CSP was changed to CS289, page 92
• The side views in the following Chip Scale Package (UC/CS/VF), page 78 drawings were corrected
to show half sphere bumps instead of solder balls (SAR 26665):
• UC36, page 79
• UC81, page 80
• CS81, page 81
•The CS281, page 89 Chip Scale Package (UC/CS/VF), page 78 section is new (SAR 27106).
• The A1 dimension values were changed to 0.07 REF in the Chip Scale Package Dimensions,
page 93 for UC36, page 79, UC81, page 80, and CS81, page 81 (SAR 26432). The c dimension
values were changed to 0.21 REF. The text, “MO-195, Variation AB,” was deleted from the heading
for these two packages. The b dimension values for the CS81, page 81 package were revised.
1.25 Revsion v11.4
The "CCGA Dimensions" table was updated. The D1 and E1 dimensions for CG484 were changed from
22.00 to 21 (SAR 22814).
1.26 Revision v11.3
Updated dimension for FBGA 144 package in the Fine Pitch Plastic Ball Grid Array Dimensions, page 73
table.
1.27 Revision v11.2
A54SX16 was removed from the CQ256—Cavity Down with Heat Sink, page 25.
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Productinformatie
| Merk | Microchip |
| Model | RTPF500T |
| Categorie | Niet gecategoriseerd |
| Taal | Nederlands |
| Grootte | 16061 MB |
