Microchip DOC200103 handleiding
Handleiding
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Hi-Rel Standard
General Requirements
Product Specication
© 2025 Microchip Technology Inc. and its subsidiaries
DS00005937A - 5
2.4.2. Prohibited Parts, Materials and Processes
The items listed are prohibited for use in high reliability devices produced to this specication.
a. Gold metallization of package elements without a barrier metal.
b. Zinc chromate as a nish.
c. Cadmium, zinc, or pure tin external or internal to the device.
d. Plastic encapsulated semiconductor devices.
e. Ultrasonically cleaned electronic parts.
f. Heterojunction Bipolar Transistor (HBT) technology.
2.4.3. Assembly
Manufacturing utilizes standardized procedures, processes, and verication methods to produce
MIL-PRF-55310 Class S/MIL-PRF-38534 Class K equivalent devices. MIL-PRF-38534 Group B Option 1
in-line inspection is included on design pedigrees E and R per paragraph 7.1 to further verify lot
pedigree. Devices are handled in accordance with the Microchip document QSP-91502 (Procedure
for Electrostatic Discharge Precautions). Element replacement will be as specied in MIL-PRF-38534,
Rev L.
2.4.4. Inspecon
The inspection requirements of MIL-PRF-55310 apply to all devices delivered to this document.
Inspection conditions and standards are documented in accordance with the Quality Assurance,
ISO-9001 and AS9100 derived, System of QSP-90100.
2.4.5. Test
The Screening test matrix of Table 6-8 is tailored for selectable-combination testing to eliminate
costs associated with the development/maintenance of device-specic documentation packages
while maintaining performance integrity.
2.4.6. Marking
Device marking shall be in accordance with the requirements of MIL-PRF-55310. In addition, when
devices are identied with laser marking, the Resistance to Solvents test specied in MIL-PRF-55310
Group C, MIL-PRF-55310 Qualication or MIL-PRF-38534 Group B Inspection will not be performed.
2.4.7. Ruggedized COTS Design Implementaon
Design Pedigree “D” devices (see 4.2. Optional Design, Test, and Data Parameters) use the same
robust designs as the other device pedigrees. They do not include the provisions of traceability or
the Class-qualied componentry noted in 2.4.3. Assembly and 3.1. Components.
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Productinformatie
| Merk | Microchip |
| Model | DOC200103 |
| Categorie | Niet gecategoriseerd |
| Taal | Nederlands |
| Grootte | 4591 MB |
