Handleiding
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Contents
About this manual . . . . . . . . . . . . iii
Chapter 1. Safety information . . . . . . 1
General safety . . . . . . . . . . . . . . . . 1
Electrical safety . . . . . . . . . . . . . . . . 1
Safety inspection guide . . . . . . . . . . . . . 2
Handling devices that are sensitive to electrostatic
discharge . . . . . . . . . . . . . . . . . . 3
Grounding requirements . . . . . . . . . . . . 4
Safety notices (multilingual translations) . . . . . . 4
Chapter 2. General checkout . . . . . 21
What to do first . . . . . . . . . . . . . . . 21
CRU list . . . . . . . . . . . . . . . . . . 22
Chapter 3. Identifying FRUs
(CRUs) . . . . . . . . . . . . . . . . . 23
Locate FRUs and CRUs . . . . . . . . . . . 23
Chapter 4. Removing a FRU or
CRU . . . . . . . . . . . . . . . . . . 27
Service tools . . . . . . . . . . . . . . . . 27
General guidelines. . . . . . . . . . . . . . 27
Handling thermal interface materials . . . . . . 28
Type, quantity, and areas of thermal interface
materials application on the heat sink . . . . 28
Areas on the system board where thermal
interface materials are applied . . . . . . . 29
Remove the lower case . . . . . . . . . . . . 29
Remove the battery pack . . . . . . . . . . . 30
Remove the solid-state drives . . . . . . . . . 31
Remove the 2280 solid-state drive (for
ThinkBook 16p G6 IAX) . . . . . . . . . . 31
Remove the 2242 solid-state drive. . . . . . 33
Remove the DNPU (for ThinkBook 16p G6 IAX) . . 35
Remove the Wi-Fi card . . . . . . . . . . . . 36
Remove the memory shielding and the memory
module . . . . . . . . . . . . . . . . . . 38
Remove the HDMI bracket . . . . . . . . . . 39
Remove the DC-in bracket . . . . . . . . . . 40
Remove the thermal module . . . . . . . . . . 41
Remove the touchpad board cable . . . . . . . 44
Remove the forcepad board cables (for ThinkBook
16p G6 IAX) . . . . . . . . . . . . . . . . 45
Remove the coin-cell battery. . . . . . . . . . 46
Remove the USB-A bracket . . . . . . . . . . 47
Remove the I/O board and the bracket . . . . . . 48
Remove the fingerprint sensor module (for
ThinkBook 16p G6 IAX) . . . . . . . . . . . . 50
Remove the power button and the power cable (for
ThinkBook 16p G6 ADR) . . . . . . . . . . . 52
Remove the system board and the I/O board
cable . . . . . . . . . . . . . . . . . . . 53
Write key product information to a
replacement system board. . . . . . . . . 56
Remove the speakers (for ThinkBook 16p G6
IAX) . . . . . . . . . . . . . . . . . . . 57
Remove the woofers (near the battery) . . . . 57
Remove the tweeters (under the system
board) . . . . . . . . . . . . . . . . . 58
Remove the thermal fin . . . . . . . . . . . . 59
Remove the hinge cap . . . . . . . . . . . . 60
Remove the LCD module . . . . . . . . . . . 62
Remove the upper case (with keyboard) . . . . . 65
Disassemble the LCD module . . . . . . . . . 65
Remove the LCD bezel . . . . . . . . . . 65
Remove the LCD panel . . . . . . . . . . 66
Remove the camera shutter . . . . . . . . 68
Remove the ALS rubber (for ThinkBook 16p
G6 IAX) . . . . . . . . . . . . . . . . 68
Remove the microphone rubbers . . . . . . 69
Remove the IR sponges (for ThinkBook 16p
G6 IAX) . . . . . . . . . . . . . . . . 70
Remove the camera board. . . . . . . . . 71
Appendix A. Label locations. . . . . . 73
Appendix B. Artworks for laser
etched labels (for ThinkBook 16p G6
IAX) . . . . . . . . . . . . . . . . . . . 77
Appendix C. Artworks for laser
etched labels (for ThinkBook 16p G6
ADR) . . . . . . . . . . . . . . . . . . 81
Trademarks . . . . . . . . . . . . . . . lxxxiii
© Copyright Lenovo 2025 i
Bekijk gratis de handleiding van Lenovo ThinkBook 16p Gen 6, stel vragen en lees de antwoorden op veelvoorkomende problemen, of gebruik onze assistent om sneller informatie in de handleiding te vinden of uitleg te krijgen over specifieke functies.
Productinformatie
| Merk | Lenovo |
| Model | ThinkBook 16p Gen 6 |
| Categorie | Laptop |
| Taal | Nederlands |
| Grootte | 19453 MB |
