Handleiding
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Contents
About this manual . . . . . . . . . . . . iii
Chapter 1. Safety information . . . . . . 1
General safety . . . . . . . . . . . . . . . . 1
Electrical safety . . . . . . . . . . . . . . . . 1
Safety inspection guide . . . . . . . . . . . . . 2
Handling devices that are sensitive to electrostatic
discharge . . . . . . . . . . . . . . . . . . 3
Grounding requirements . . . . . . . . . . . . 4
Safety notices (multilingual translations) . . . . . . 4
Chapter 2. General checkout . . . . . 21
What to do first . . . . . . . . . . . . . . . 21
CRU list . . . . . . . . . . . . . . . . . . 22
Chapter 3. Identifying FRUs
(CRUs) . . . . . . . . . . . . . . . . . 23
Locate FRUs and CRUs . . . . . . . . . . . 23
Chapter 4. Removing a FRU or
CRU . . . . . . . . . . . . . . . . . . 27
Service tools . . . . . . . . . . . . . . . . 27
General guidelines. . . . . . . . . . . . . . 27
Handling thermal interface materials . . . . . . 28
Type, quantity, and areas of thermal interface
materials application on the thermal module . . 28
Area on the system board where thermal
interface materials are applied . . . . . . . 29
Remove the lower case . . . . . . . . . . . . 30
Remove the battery pack . . . . . . . . . . . 31
Remove the touchpad bracket . . . . . . . . . 32
Remove the speakers . . . . . . . . . . . . 32
Remove the DC-in bracket . . . . . . . . . . 33
Remove the Wi-Fi card . . . . . . . . . . . . 34
Remove the 2242 solid-state drive (for selected
models) . . . . . . . . . . . . . . . . . . 36
Remove the 2280 solid-state drive (for selected
models) . . . . . . . . . . . . . . . . . . 36
Remove the CMOS battery . . . . . . . . . . 37
Remove the DIMM shielding . . . . . . . . . . 38
Remove the memory module . . . . . . . . . 39
Remove the strip cover . . . . . . . . . . . . 40
Remove the thermal module . . . . . . . . . . 42
Remove the system board. . . . . . . . . . . 43
Use a Golden Key U1 tool to flash-write key id
information . . . . . . . . . . . . . . . 45
Remove the Type-C bracket . . . . . . . . . . 45
Remove the LCD module . . . . . . . . . . . 46
Remove the upper case (with keyboard) . . . . . 48
Disassemble the LCD module . . . . . . . . . 48
Remove the LCD bezel . . . . . . . . . . 48
Remove the LCD panel . . . . . . . . . . 49
Remove the camera board . . . . . . . . . 50
Remove the camera cable . . . . . . . . . 51
Remove the EDP cable . . . . . . . . . . 52
Remove the hinges. . . . . . . . . . . . 53
Remove the hinge caps . . . . . . . . . . 54
Remove the LCD cover . . . . . . . . . . 55
Chapter 5. Label locations . . . . . . 57
Trademarks . . . . . . . . . . . . . . . . . lix
© Copyright Lenovo 2023 i
Bekijk gratis de handleiding van Lenovo LOQ 15IAX9, stel vragen en lees de antwoorden op veelvoorkomende problemen, of gebruik onze assistent om sneller informatie in de handleiding te vinden of uitleg te krijgen over specifieke functies.
Productinformatie
| Merk | Lenovo |
| Model | LOQ 15IAX9 |
| Categorie | Laptop |
| Taal | Nederlands |
| Grootte | 13877 MB |
Caratteristiche Prodotto
| Kleur van het product | Grijs |
| Gewicht | 2380 g |
| Breedte | 359.86 mm |
| Diepte | 258.7 mm |
| Materiaal behuizing | Acrylonitrile butadiene styrene (ABS), Polycarbonate (PC) |
