Handleiding
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Contents
About this manual . . . . . . . . . . . . iii
Chapter 1. Safety information . . . . . . 1
General safety . . . . . . . . . . . . . . . . 1
Electrical safety . . . . . . . . . . . . . . . . 1
Safety inspection guide . . . . . . . . . . . . . 2
Handling devices that are sensitive to electrostatic
discharge . . . . . . . . . . . . . . . . . . 3
Grounding requirements . . . . . . . . . . . . 4
Safety notices (multilingual translations) . . . . . . 4
Chapter 2. General checkout . . . . . 19
What to do first . . . . . . . . . . . . . . . 19
CRU list . . . . . . . . . . . . . . . . . . 20
Chapter 3. Identifying FRUs
(CRUs) . . . . . . . . . . . . . . . . . 21
Locate FRUs and CRUs . . . . . . . . . . . 21
Chapter 4. Removing a FRU or
CRU . . . . . . . . . . . . . . . . . . 25
Service tools . . . . . . . . . . . . . . . . 25
General guidelines. . . . . . . . . . . . . . 25
Handling thermal interface materials . . . . . . 26
Type, quantity, and areas of thermal interface
materials application on the heat sink (for
UMA) . . . . . . . . . . . . . . . . . 26
Type, quantity, and areas of thermal interface
materials application on the heat sink (for
DIS). . . . . . . . . . . . . . . . . . 27
Areas on the system board where thermal
interface materials are applied . . . . . . . 27
Remove the lower case . . . . . . . . . . . . 28
Remove the battery pack and battery pack
cable . . . . . . . . . . . . . . . . . . . 29
Remove the solid-state drive (SSD) plate . . . . . 30
Remove the solid-state drive (SSD) . . . . . . . 30
Remove the Wi-Fi card . . . . . . . . . . . . 31
Remove the Type-C bracket . . . . . . . . . . 32
Remove the heat sink . . . . . . . . . . . . 33
Remove the fans . . . . . . . . . . . . . . 33
Remove the I/O board . . . . . . . . . . . . 34
Remove the system board and the I/O board
cable . . . . . . . . . . . . . . . . . . . 37
Use a Golden Key U1 tool to flash-write key id
information . . . . . . . . . . . . . . . 39
Remove the LCD module . . . . . . . . . . . 39
Remove the upper case. . . . . . . . . . . . 40
Disassemble the LCD module (for LCD panels
only) . . . . . . . . . . . . . . . . . . . 40
Remove the hinge cover. . . . . . . . . . 41
Remove the LCD bezel . . . . . . . . . . 41
Remove the LCD panel . . . . . . . . . . 42
Remove the microphone rubber. . . . . . . 43
Remove the ToF rubber . . . . . . . . . . 44
Remove the camera cable . . . . . . . . . 44
Remove the camera board . . . . . . . . . 45
Remove the LCD cover . . . . . . . . . . 46
Appendix A. Label locations. . . . . . 47
Trademarks . . . . . . . . . . . . . . . . xlix
© Copyright Lenovo 2023 i
Bekijk gratis de handleiding van Lenovo IdeaPad Pro 5, stel vragen en lees de antwoorden op veelvoorkomende problemen, of gebruik onze assistent om sneller informatie in de handleiding te vinden of uitleg te krijgen over specifieke functies.
Productinformatie
| Merk | Lenovo |
| Model | IdeaPad Pro 5 |
| Categorie | Laptop |
| Taal | Nederlands |
| Grootte | 10575 MB |
