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24
COOKING TEST
Tested in compliance with the EN 60350-1 standard.
BAKING
Dish
Equipment
Guide (from
the bottom)
System
Temperature
(°C)
Cooking time
(minutes)
Cookies
single level
shallow enamel-
coated baking sheet
3
140-150*
20-35
Cookies
single level
3
140-150*
20-35
Cookies
two levels
2, 3
140-150*
30-45
Cookies
three levels
2, 3, 4
130-140*
30-45
Cupcakes
single level
shallow enamel-
coated baking sheet
3
160-170*
20-35
Cupcakes
single level
3
160-170*
20-35
Cupcakes
two levels
2, 3
140-150*
30-45
Cupcakes
three levels
2, 3, 4
140-150*
35-50
Cake
round metal mould
ø26/wire shelf
(support grid)
2
160-170*
20-35
Cake
2
160-170*
20-35
Apple pie
2x round metal
mould ø20/wire
shelf (support grid)
2
170-180
50-70
Apple pie
3
160-170
50-70
Toast
wire shelf/grid
4
230*
0,5-3
Minced meat
patty
wire shelf (support
grid) + shallow
baking sheet as drip
tray
4
230
20-35
* Preheat for 10 minutes.
SAP 928154en
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Productinformatie
| Merk | Hisense |
| Model | H2CC8647WB |
| Categorie | Fornuis |
| Taal | Nederlands |
| Grootte | 3928 MB |
