Advantech SKY-MXM-A1000 handleiding
Handleiding
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SKY-MXM-A1000 User Manual 12
2.7 Mechanical and Environmental Specifications
Table 2.3 describes the mechanical characteristics of the packages.
Table 2.3: Mechanical and Environmental Specifications
Symbol Parameter Min. Nominal Max. Units Notes
P
cont
Maximum allowable pres-
sure during PCA, system
assembly, and operation
-
≤60
≤80 (die edge)
psi 1
Tpkg
Maximum allowable pack-
age temperature during
device operation
-
≤ 89 °C (GPU
Max Operating
Temperature)
°C 2
e
max
Maximum allowable strain
during PCA, system assem-
bly, or operation
≤ 500 μstrains 3
Note! 1. This specification is based on the following conditions:
a. This specification is based on solder ball deformation and die
chips and cracks. Additional requirements may be needed to meet
the thermal performance and/or long-term reliability as to specific
applications.
b. When a compliant thermal interface is used between die and
heat sink, the bond line thickness must have less than 20% in vari-
ation.
c. The pressure should be measured on the top of the die surface
by an instrument equipped with pressure sensors. See details in
the “GPU Load Distribution Measurement Application Note”.
d. Nominal pressure is the total force divided by the die surface
area. Since the pressure may have variations across the whole
surface, the following additional requirement is applied:
i. The pressure has to be measured from the top of the die surface
with a grid resolution of 1x1 mm2 for the pressure sensor.
e. Both nominal and maximum pressure requirements must be
met.
2. Maximum package temperature allowed. It includes device case
and/or junction temperature.
3. The strain measurement shall follow IPC-9704, particularly for the
following items:
a. The strain shall be measured on the top side of the PCB close to
the four corners of the package. A rigid PCB is assumed.
b. For generic applications, the max. allowable strain must be no
more than 500 μstrains for a board thickness from 1.0 to 3.2mm. A
separate requirement may be specified and the qualification test
should be performed if:
i. A sensitive PCB laminate and build-up structure is used where
the pad cratering occurs at a PCB strain of 500 μstrains or below.
ii. A weak surface finish on the PCB is used where cracked solder
joints have been observed at a PCB strain of 500 μstrains or below.
iii. The strain rate is too high (.5000 μstrains/second) during PCA
operations.
c. For PCB thickness less than 1.0 mm, the max. allowable strain
shall follow IPC 9704.
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Productinformatie
| Merk | Advantech |
| Model | SKY-MXM-A1000 |
| Categorie | Niet gecategoriseerd |
| Taal | Nederlands |
| Grootte | 1920 MB |
